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INTEGRATED CIRCUITS DATA SHEET TZA3023 SDH/SONET STM4/OC12 transimpedance amplifier Product specification Supersedes data of 2000 Mar 29 2002 Sep 05 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier FEATURES * Wide dynamic input range from 1 A to 1.5 mA * Low equivalent input noise of 3.5 pA/Hz (typical) * Differential transimpedance of 21 k * Wide bandwidth from DC to 600 MHz * Differential outputs * On-chip Automatic Gain Control (AGC) * No external components required * Single supply voltage from 3.0 to 5.5 V * Bias voltage for PIN diode * Pin compatible with SA5223 * Goldplated version available for direct placement of photodiode on die. ORDERING INFORMATION TYPE NUMBER TZA3023T TZA3023U TZA3023U/G PACKAGE NAME SO8 - - DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm bare die in waffle pack carriers; die dimensions 1.030 x 1.300 mm bare die with goldplating in waffle pack carriers; die dimensions 1.030 x 1.300 mm APPLICATIONS TZA3023 * Digital fibre optic receiver in short, medium and long haul optical telecommunications transmission systems or in high-speed data networks * Wideband RF gain block. DESCRIPTION The TZA3023 is a low-noise transimpedance amplifier with AGC designed to be used in STM4/OC12 fibre optic links. It amplifies the current generated by a photo detector (PIN diode or avalanche photodiode) and converts it to a differential output voltage. VERSION SOT96-1 - - 2002 Sep 05 2 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier BLOCK DIAGRAM TZA3023 handbook, full pagewidth VCC 8 (11, 12) 2 k DREF 1 (1) GAIN CONTROL AGC(1) (13) peak detector IPhoto 3 (4) 7 (10) OUTQ A1 low noise amplifier single-ended to differential converter 6 (9) OUT TZA3023 2, 4, 5 (2, 3, 5, 6, 7, 8) BIASING MGK918 GND The numbers in brackets refer to the pad numbers of the bare die version. (1) AGC analog I/O is only available on the TZA3023U (pad 13). Fig.1 Block diagram. 2002 Sep 05 3 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier PINNING SYMBOL DREF GND IPhoto GND GND OUT OUTQ VCC AGC Note 1. For the TZA3023U/G this pad is connected to the gold layer on top of the passivation layer. PIN TZA3023T 1 2 3 4 5 6 7 8 - PAD TZA3023U 1 2, 3 4 5, 6 7, 8 9 10 11, 12 13 TYPE analog output ground analog input ground ground output output supply input/output DESCRIPTION TZA3023 bias voltage for PIN diode; cathode should be connected to this pin; note 1 ground current input; anode of PIN diode should be connected to this pin; DC bias level of 800 mV, one diode voltage above ground ground ground data output; pin OUT goes HIGH when current flows into pin IPhoto data output; compliment of pin OUT supply voltage AGC analog I/O handbook, halfpage DREF 1 GND 2 8 VCC 7 OUTQ OUT GND TZA3023T IPhoto GND 3 4 MGK917 6 5 Fig.2 Pin configuration. 2002 Sep 05 4 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier FUNCTIONAL DESCRIPTION The TZA3023 is a transimpedance amplifier intended for use in fibre optic links for signal recovery in STM4/OC12 applications. It amplifies the current generated by a photo detector (PIN diode or avalanche photodiode) and transforms it into a differential output voltage. The most important characteristics of the TZA3023 are high receiver sensitivity and wide dynamic range. High receiver sensitivity is achieved by minimizing noise in the transimpedance amplifier. The signal current generated by a PIN diode can vary between 1 A to 1.5 mA (p-p). An AGC loop is implemented to make it possible to handle such a wide dynamic range. The AGC loop increases the dynamic range of the receiver by reducing the feedback resistance of the preamplifier. TZA3023 The AGC loop hold capacitor is integrated on-chip, so an external capacitor is not needed for AGC. The AGC voltage can be monitored at pad 13 on the bare die (TZA3023U). Pad 13 is not bonded in the packaged device (TZA3023T). This pad can be left unconnected during normal operation. It can also be used to force an external AGC voltage. If pad 13 is connected to GND, the internal AGC loop is disabled and the receiver gain is at a maximum. The maximum input current is then approximately 50 A. A differential amplifier converts the single-ended output of the preamplifier to a differential output voltage (see Fig.3). handbook, full pagewidth VCC 600 600 30 30 VOUTQ VOUT 4.5 mA 2 mA 4.5 mA MGK922 Fig.3 Data output buffer. handbook, full pagewidth CML/PECL OUTPUT VCC VO(max) VOQH VOH Vo (p-p) VOQL VOL VO(min) VOO MGK885 Fig.4 Logic level symbol definitions for data outputs OUT and OUTQ. 2002 Sep 05 5 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier PIN diode bias voltage DREF The transimpedance amplifier together with the PIN diode determines the performance of an optical receiver for a large extent. Especially how the PIN diode is connected to the input and the layout around the input pin influence the key parameters like sensitivity, bandwidth and the Power Supply Rejection Ratio (PSRR) of a transimpedance amplifier. The total capacitance at the input pin is critical to obtain the highest sensitivity. It should be kept to a minimum by reducing the capacitor of the PIN diode and the parasitics around the input pin. The PIN diode should be placed very close to the IC to reduce the parasitics. Because the capacitance of the PIN diode depends on the reverse voltage across it, the reverse voltage should be chosen as high as possible. The PIN diode can be connected to the input in two ways as shown in Figs 5 and 6. In Fig.5 the PIN diode is connected between DREF and IPhoto. Pin DREF provides an easy bias voltage for the PIN diode. The voltage at DREF is derived from VCC by a low-pass filter. The low-pass filter consisting of the internal resistor R1, C1 and the external capacitor C2 rejects the supply voltage noise. The external capacitor C2 should be equal or larger then 1 nF for a high PSRR. TZA3023 The reverse voltage across the PIN diode is 4.2 V (5 - 0.8 V) for 5 V supply or 2.5 V (3.3 - 0.8 V) for 3.3 V supply. The DC voltage at DREF decreases with increasing signal levels. Consequently the reverse voltage across the PIN diode will also decrease with increasing signal levels. This can be explained with an example. When the PIN diode delivers a peak-to-peak current of 1 mA, the average DC current will be 0.5 mA. This DC current is delivered by VCC through the internal resistor R1 of 2 k which will cause a voltage drop of 1 V across the resistor and the reverse voltage across the PIN diode will be reduced by 1 V. It is preferable to connect the cathode of the PIN diode to a higher voltage then VCC when such a voltage source is available on the board. In this case pin DREF can be left unconnected. When a negative supply voltage is available, the configuration in Fig.6 can be used. It should be noted that in this case the direction of the signal current is reversed compared to Fig.5. Proper filtering of the bias voltage for the PIN diode is essential to achieve the highest sensitivity level. VCC R1 2 k 4 Ii C1 10 pF 8 DREF 4 VCC R1 2 k C1 10 pF 8 DREF C2 1 nF 7 IPhoto Ii IPhoto 7 TZA3023 MCD900 TZA3023 MCD901 negative supply voltage Fig.5 The PIN diode connected between the input and pin DREF. Fig.6 The PIN diode connected between the input and a negative supply voltage. 2002 Sep 05 6 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier AGC TZA3023 transimpedance amplifier can handle input currents from 0.5 A to 1.5 mA. This means a dynamic range of 72 dB. At low input currents, the transimpedance must be high to get enough output voltage, and the noise should be low enough to guaranty minimum bit error rate. At high input currents however, the transimpedance should be low to avoid pulse width distortion. This means that the gain of the amplifier has to vary depending on the input signal level to handle such a wide dynamic range. This is achieved in the TZA3023 by implementing an Automatic Gain Control (AGC) loop. The AGC loop consists of a peak detector, a hold capacitor and a gain control circuit. The peak amplitude of the signal is detected by the peak detector and it is stored on the hold capacitor. The voltage over the hold capacitor is compared to a threshold level. The threshold level is set to 10 A (p-p) input current. AGC becomes active only for input signals larger than the threshold level. TZA3023 It is disabled for smaller signals. The transimpedance is then at its maximum value (21 k differential). When the AGC is active, the feedback resistor of the transimpedance amplifier is reduced to keep the output voltage constant. The transimpedance is regulated from 21 k at low currents (I < 10 A) to 800 at high currents (I < 500 A). Above 500 A the transimpedance is at its minimum and can not be reduced further but the front-end remains linear until input currents of 1.5 mA. The upper part of Fig.7 shows the output voltages of the TZA3023 (OUT and OUTQ) as a function of the DC input current. In the lower part, the difference of both voltages is shown. It can be seen from the figure that the output changes linearly up to 10 A input current where AGC becomes active. From this point on, AGC tries to keep the differential output voltage constant around 200 mV for medium range input currents (input currents <200 A). The AGC can not regulate any more above 600 A input current, and the output voltage rises again with the input current. MCD914 handbook, full pagewidth V 1.8 o (V) VOUT 1.6 1.4 VCC = 3 V 1.2 VOUTQ 1 600 Vo(dif) (mV) 400 (2) (3) (1) 200 0 1 10 102 103 Ii (A) 104 Vo(dif) = VOUT - VOUTQ. (1) VCC = 3 V. (2) VCC = 3.3 V. (3) VCC = 5 V. Fig.7 AGC characteristics. 2002 Sep 05 7 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC Vn supply voltage DC voltage pin 3/pad 4: IPhoto pins 6 and 7/pads 9 and 10: OUT and OUTQ pad 13: AGC (TZA3023U only) pin 1/pad 1: DREF In DC current pin 3/pad 4: IPhoto pins 6 and 7/pads 9 and 10: OUT and OUTQ pad 13: AGC (TZA3023U only) pin 1/pad 1: DREF Ptot Tstg Tj Tamb HANDLING total power dissipation storage temperature junction temperature ambient temperature -1 -15 -0.2 -2.5 - -65 - -40 +2.5 +15 +0.2 +2.5 300 +150 125 +85 -0.5 -0.5 -0.5 -0.5 +1 PARAMETER MIN. -0.5 TZA3023 MAX. +6 V V V V V UNIT VCC + 0.5 VCC + 0.5 VCC + 0.5 mA mA mA mA mW C C C Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can be obtained by bonding the VCC and GND pads first, the remaining pads may then be bonded to their external connections in any order. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient VALUE 160 UNIT K/W 2002 Sep 05 8 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier TZA3023 CHARACTERISTICS Typical values at Tamb = 25 C and VCC = 5 V; minimum and maximum values are valid over the entire ambient temperature range and supply range; all voltages are measured with respect to ground; unless otherwise specified. SYMBOL VCC ICC PARAMETER supply voltage supply current VCC = 5 V; AC coupled; RL = 50 VCC = 3.3V; AC coupled; RL = 50 Ptot Tj Tamb Rtr total power dissipation junction temperature ambient temperature differential small-signal transresistance of the receiver high frequency -3 dB point power supply rejection ratio VCC = 5 V; AC coupled; RL = 50 VCC = 3.3 V; AC coupled; RL = 50 VCC = 5 V; Ci = 0.7 pF VCC = 3.3 V; Ci = 0.7 pF PSRR measured differentially; note 1 f = 100 kHz to 10 MHz f = 10 to 100 MHz f = 100 MHz to 1 GHz Bias voltage: pin DREF RDREF resistance between pins DREF and VCC input bias voltage on pin IPhoto input current on pin IPhoto (peak-to-peak value) small-signal input resistance total integrated RMS noise current over bandwidth (referenced to input) VCC = 5 V; note 2 VCC = 3.3 V; note 2 fi = 1 MHz; input current <2 A (p-p) note 3 f = 311 MHz f = 450 MHz f = 622 MHz - - - 55 80 120 - - - nA nA nA DC tested 1680 2000 2320 - - - 1 2 5 2 5 100 A/V A/V A/V VCC = 5 V VCC = 3.3 V CONDITIONS 3 23 20 - - -40 -40 17.5 16 450 440 MIN. 5 28 28 140 95 - +25 21 19.5 580 520 TYP. 45 42 248 152 +125 +85 25 25 750 600 MAX. 5.5 UNIT V mA mA mW mW C C k k MHz MHz f-3dB(h) Input: pin IPhoto Vbias(IPhoto) Ii(IPhoto)(p-p) Ri In(tot) 720 -1500 -1000 - 800 +4 +4 95 970 +1500 +1000 - mV A A 2002 Sep 05 9 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier SYMBOL PARAMETER CONDITIONS MIN. VCC - 2 TYP. VCC - 1.7 200 0 50 510 550 TZA3023 MAX. VCC - 1.4 330 +100 62 700 700 UNIT Data outputs: pins OUT and OUTQ Vo(cm) Vo(se)(p-p) VOO Ro(se) tr, tf common mode output voltage AC coupled; RL = 50 single-ended output voltage (peak-to-peak value) differential output offset voltage single-ended output resistance rise time, fall time DC tested V mV mV ps ps AC coupled; RL = 50 ; 75 input current 100 A (p-p) -100 40 VCC = 5 V; 20% to 80%; 400 input current <10 A (p-p) VCC = 3.3 V; 20% to 80%; 450 input current <10 A (p-p) Automatic gain control loop: pad AGC Ith(AGC) tatt(AGC) tdecay(AGC) Notes 1. PSRR is defined as the ratio of the equivalent current change at the input (IIPhoto) to a change in supply voltage: I IPhoto PSRR = ------------------V CC For example, a + 4 mV disturbance on VCC at 10 MHz will typically add an extra 8 nA to the photodiode current. The external capacitor between pins DREF and GND has a large impact on the PSRR. The specification is valid with an external capacitor of 1 nF. The PSSR is guaranteed by design. 2. The Pulse Width Distortion (PWD) is <5% over the whole input current range. The PWD is defined as: pulse width PWD = ----------------------------- - 1 x 100% where T is the clock period. The PWD is measured differentially with T PRBS pattern of 10-23. 3. All In(tot) measurements were made with an input capacitance of Ci = 1.2 pF. This was comprised of 0.7 pF for the photodiode itself, with 0.3 pF allowed for the printed-circuit board layout and 0.2 pF intrinsic to the package. Noise performance is measured differentially. AGC threshold current AGC attack time AGC decay time referred to the peak input - current; tested at 10 MHz - - 10 5 10 - - - A s ms 2002 Sep 05 10 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier TYPICAL PERFORMANCE CHARACTERISTICS MCD908 TZA3023 handbook, halfpage 40 ICC handbook, halfpage 31.4 MCD909 (mA) 36 (2) ICC (mA) 31.0 32 (1) (3) 30.6 28 24 30.2 20 -40 0 40 80 Tj (C) 120 29.8 3 4 5 VCC (V) 6 (1) VCC = 5 V. (2) VCC = 3.3 V. (3) VCC = 3 V. Fig.8 Supply current as a function of the junction temperature. Fig.9 Supply current as a function of the supply voltage. handbook, halfpage 808 MCD910 handbook, halfpage 900 MCD911 Vi (mV) 806 Vi (mV) 820 (2) (1) (3) 804 740 802 800 3 4 5 VCC (V) 6 660 -40 0 40 80 Tj (C) 120 (1) VCC = 5 V. (2) VCC = 3.3 V. (3) VCC = 3 V. Fig.10 Input voltage as a function of the supply voltage. Fig.11 Input voltage as a function of the junction temperature. 2002 Sep 05 11 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier TZA3023 handbook, halfpage 1.686 MCD912 handbook, halfpage 1.85 MCD913 Vo(cm) (V) 1.680 (1) Vo(cm) (V) 1.75 (1) (2) 1.674 1.65 1.668 (2) 1.662 3 4 5 VCC (V) 6 1.55 -40 0 40 80 Tj (C) 120 (1) VCC - VOUT. (2) VCC - VOUTQ. VCC = 3.3 V. (1) VCC - VOUT. (2) VCC - VOUTQ. Fig.12 Common mode voltage at the output as a function of the supply voltage. Fig.13 The common mode voltage at the output as a function of the junction temperature. 2002 Sep 05 12 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier APPLICATION AND TEST INFORMATION TZA3023 handbook, full pagewidth 10 H 22 nF VCC 8 DREF 1 680 nF VP 7 OUTQ OUT Zo = 50 100 nF TZA3023T IPhoto 1 nF 2 GND 4 GND 5 GND 6 3 Zo = 50 100 nF 50 50 MCD898 Fig.14 Application diagram. 2002 Sep 05 13 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... k, full pagewidth 2002 Sep 05 VCC (1) Philips Semiconductors SDH/SONET STM4/OC12 transimpedance amplifier 680 nF (1) (1) 22 nF VCC 8 DREF 1 nF OUTQ 8 pF 6 OUT noise filter: 1-pole, 400 MHz GND 16.4 nH 7.5 pF 1.1 pF 100 10 nF DINQ 10 nF DIN 100 nF VCCA 6 61 k RSET 16 7 CF Vref 15 VCCD 14 100 nF 1 7 4 13 DOUT data out TZA3023T IPhoto 3 TZA3044 5 12 DOUTQ 14 2 GND 4 GND 5 3 AGND 1 SUB 8 JAM 9 STQ 10 ST 11 DGND level-detect status 1 k 50 50 VCC - 2 V MCD899 16.4 nH optional noise filter: 3-pole, 470 MHz Bessel Product specification TZA3023 (1) Ferrite bead e.g. Murata BLM10A700S. Fig.15 STM4/OC12 receiver using the TZA3023T and postamplifier TZA3044. Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier Test circuits TZA3023 handbook, full pagewidth ZT = s21.(R + Zi) . 2 R = 1 k, Zi = 100 NETWORK ANALYZER S-PARAMETER TEST SET PORT 1 Zo = 50 VCC 223-1 PRBS 100 nF PATTERN GENERATOR C C D D TR C IN 10 nF 1 k IPhoto 51 OUTQ 100 nF OUT SAMPLING OSCILLOSCOPE/ TDR/TDT 1 2 TR PORT 2 Zo = 50 TZA3023 OM5803 Zo = 50 MCD902 Fig.16 Electrical test circuit. 2002 Sep 05 15 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier TZA3023 handbook, full pagewidth LIGHTWAVE MULTIMETER -9.54 dBm OPTICAL INPUT ERROR DETECTOR OPTICAL ATTENUATOR 0 dBm/1300 IN OUT 90% 10% VCC Data in Clock in 22 nF 223-1 PRBS PATTERN GENERATOR C C D D TR C IN DINQ Laser DREF LASER DRIVER DIN PIN 10 nF IPhoto 100 nF OUT SAMPLING OSCILLOSCOPE/ TDR/TDT TR 1 2 OUTQ 100 nF TZA3023 TZA3001 OM5802 622.080 MHz OM5804 Zo = 50 MCD903 Fig.17 Optical test circuit. 2002 Sep 05 16 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier TZA3023 handbook, full pagewidth MCD904 Fig.18 Differential output with -30 dBm optical input power [input current of 1.63 A (p-p)]. handbook, full pagewidth MCD905 Fig.19 Differential output with -20 dBm optical input power [input current of 16.3 A (p-p)]. 2002 Sep 05 17 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier TZA3023 handbook, full pagewidth MCD906 Fig.20 Differential output with -10 dBm optical input power [input current of 163 A (p-p)]. handbook, full pagewidth MCD907 Fig.21 Differential output with -2 dBm optical input power [input current of 1030 A (p-p)]. 2002 Sep 05 18 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier BONDING PAD LOCATIONS AGC VCC TZA3023 COORDINATES(1) SYMBOL DREF GND GND IPhoto GND GND GND GND OUT OUTQ VCC VCC AGC Note 1. All coordinates are referenced, in m, to the bottom left-hand corner of the die. PAD x 1 2 3 4 5 6 7 8 9 10 11 12 13 95 95 95 95 215 360 549 691 785 785 567 424 259 y 881 618 473 285 95 95 95 95 501 641 1055 1055 1055 x GND 0 0 y 5 IPhoto 4 1300 GND m GND 2 3 DREF 1 13 12 11 VCC TZA3023U 10 9 OUTQ OUT 6 GND 7 GND 1030 m 8 GND MCD897 Fig.22 Bonding pad locations of the TZA3023U. AGC VCC 12 handbook, full pagewidth 13 11 DREF 1 VCC 1300 GND m GND 2 3 TZA3023U/G 10 9 OUTQ 725 m OUT IPhoto 4 5 x GND 0 6 GND 7 GND 1030 m 8 GND 0 y 455 m MCE067 Fig.23 Bonding pad plus gold plate locations of the TZA3023U/G. 2002 Sep 05 19 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier Physical characteristics of the bare die PARAMETER Gold layer(1) 2.8 m Au + 3.2 m TiW 2.1 m PSG (PhosphoSilicate Glass) on top of 0.65 m oxynitride Glass passivation Bonding pad dimension Metallization Thickness Size Backing Attach temperature Attach time Note 1. For the TZA3023U/G version only. VALUE TZA3023 minimum dimension of exposed metallization is 90 x 90 m (pad size = 100 x 100 m) 1.22 m W/AlCu/TiW 380 m nominal 1.03 x 1.30 mm (1.34 mm2) silicon; electrically connected to GND potential through substrate contacts <440 C; recommended die attach is glue <15 s 2002 Sep 05 20 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm TZA3023 SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 0.010 0.057 0.069 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 0.028 0.004 0.012 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 2002 Sep 05 21 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. TZA3023 If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2002 Sep 05 22 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(3) TZA3023 SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable suitable not not recommended(4)(5) recommended(6) 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2002 Sep 05 23 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS TZA3023 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 2002 Sep 05 24 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. TZA3023 Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2002 Sep 05 25 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier NOTES TZA3023 2002 Sep 05 26 Philips Semiconductors Product specification SDH/SONET STM4/OC12 transimpedance amplifier NOTES TZA3023 2002 Sep 05 27 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613524/03/pp28 Date of release: 2002 Sep 05 Document order number: 9397 750 10128 |
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